Dicing Machine Sensor "VBI (Blade Inspection System)"
Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.
"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*
- Company：マーポス
- Price：Other
